From Undergrad to Semiconductor Packaging: Meet Heejin Roh, Product Engineer at Absolics
From California to Georgia, Heejin Roh’s journey to her role as a Product Engineer at Absolics (an SKC company) has been characterized by excitement, growth, and achievement. Heejin began her engineering career at Absolics at its Covington facility in 2024, where the company manufactures glass substrates used for advanced semiconductor packages – an integral material used in AI servers, data centers, satellite communications, and more.
“Over the past year, I’ve gained hands-on experience with equipment, optimized processes, and tackled real manufacturing issues,” says Heejin Roh. “Being able to see the impact of adjustments in real time makes the work both exciting – and rewarding.”
Learn more about Heejin Roh and the beginning of her career in manufacturing – and get a firsthand look into the day-to-day life of one of Absolics’ product engineers advancing tomorrow’s innovative breakthroughs today.
Heejin Roh, Product Engineer at Absolics
What do you like most about your career in manufacturing?
What I enjoy most is the hands-on experience I get with tools, products, and processes. Since joining the company a year ago as a junior engineer, I’ve had the opportunity to work directly with process equipment, troubleshoot issues on the production floor, and optimize key parameters to improve efficiency. Being able to see the impact of adjustments in real time makes the work both exciting and rewarding. I also appreciate the fast-paced nature of manufacturing, where every challenge is a learning opportunity that helps me grow as an engineer.
How did you first begin your career in manufacturing?
I majored in chemistry as an undergrad, where I spent a lot of time in lab classes – which were mostly geared more toward pure science vs. engineering majors. Because of this, I always thought that my future career would be limited to scientific/medical research fields. I was really fascinated to know that what I have learned can be applied to semiconductor packaging industries.
What was your career journey like into your current role?
My journey has been both challenging and rewarding. Coming fresh out of college with a major unrelated to semiconductor packaging, I had a steep learning curve. Understanding the tools, processes, and troubleshooting techniques required extra effort, but those challenges motivated me to work harder. Over the past year, I’ve gained hands-on experience with equipment, optimized processes, and tackled real manufacturing issues. Despite the difficulties, the fast-paced learning and problem-solving have made this role incredibly fulfilling.
What advice would you give to other women considering a career in manufacturing?
My advice is to stay confident and embrace challenges as learning opportunities. Manufacturing, especially in semiconductor packaging, is a fast-paced and technical field, and sometimes there are some physical demands, but don’t let that discourage you. Spend time on the production floor, work closely with the tools and processes, and ask as many questions as possible.
